G.SKILL Releases New Low CAS Latency Memory Kits

G.SKILL International Enterprise Co., Ltd, a leading brand in performance overclock memory and PC components, is excited to announce the launch of new memory kits with low CAS latency. These kits feature the AMD EXPO overclock profile specifically designed for the latest AMD Ryzen 9000 series processors and X870 chipset motherboards. The new specifications include DDR5-6000 CL26 2x16GB/2x32GB kits and 2x24GB/2x48GB memory kits available under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 RGB Neo series.

Targeting PC enthusiasts looking for high-performance overclock DDR5 memory, G.SKILL is introducing a new low CAS Latency memory kit at DDR5-6000 CL26-36-36-96 with kit capacities of 32GB (2x16GB) and the world's first 64GB (2x32GB) kit capacity for this low latency specification. These new specifications are optimized for selected X870 series motherboards and AMD Ryzen 9000 series processors, featuring the AMD EXPO memory overclocking profile. The stability of the DDR5-6000 CL26 2x32GB kit under the Memtest memory stress test on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor is demonstrated in the screenshot below.

Additionally, G.SKILL is also launching the world's first high-capacity, low-latency DDR5-6000 CL28-36-36-96 2x24GB/2x48GB memory kit, designed for content creators and professional users. This memory solution is ideal for building a high-performance AMD AM5 system on compatible X870 motherboards and AMD Ryzen 9000 series processors. The screenshot below shows the DDR5-6000 CL28 2x48GB kit being stress tested with the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

These new low-latency specifications support the AMD EXPO (Extended Profile for Overclocking) technology for easy memory overclocking via the motherboard BIOS. The kits will be available through G.SKILL's worldwide distribution partners starting in January 2025.