TSMC's Advancements in 2 nm Node Production

According to a recent report from MoneyDJ, TSMC is making strides in its development of the most advanced 2 nm (N2) node. Industry sources have revealed that the company is in the process of establishing a test production line at the Hsinchu Baoshan fab (Fab 20) in Taiwan. Initially, TSMC plans to have a small monthly output of approximately 3,000-3,500 wafers. However, the company has ambitious goals to merge production from two factories in Hsinchu and Kaohsiung. By the end of 2025, TSMC aims to deliver over 50,000 wafers monthly, with projections to reach around 125,000 wafers per month by the end of 2026.

Breaking it down by location, the Hsinchu factory is expected to achieve a monthly output of 20,000-25,000 wafers by late 2025, increasing to approximately 60,000-65,000 by early 2027. Meanwhile, the Kaohsiung factory is anticipated to produce 25,000-30,000 wafers monthly by late 2025, with a growth to 60,000-65,000 by early 2027.

TSMC's chairman C.C. Wei has noted a higher demand for these 2 nm chips compared to the 3 nm chips. This increased interest in 2 nm chips can be attributed to the significant enhancements this technology offers: it consumes 24-35% less power, operates 15% faster at the same power level, and accommodates 15% more transistors in the same space compared to the 3 nm chips. Apple is set to be the first company to utilize these chips, followed by other major tech giants such as MediaTek, Qualcomm, Intel, NVIDIA, AMD, and Broadcom.