Ventiva Announces ICE9 Thermal Management Suite

Today, Ventiva, a leader in thermal solutions, revealed that its ICE9 thermal management suite is now capable of cooling laptops operating at up to 40 watts TDP (Thermal Design Power). This advancement allows for thinner, faster, and completely silent computing devices, all without the drawbacks of traditional fan-based cooling systems. The ICE9 solution can effectively cool the powerful CPUs needed for the next generation of feature-rich, AI-enabled, high-performance laptops.

The ICE9 thermal management suite is built on Ventiva's patented Ionic Cooling Engine (ICE) technology, which eliminates the need for mechanical fans. Instead, intelligent software control ensures optimal performance in electronic devices without any moving parts, noise, or vibration. The compact ICE9 solution enables laptop designs with a height of less than 12 mm, rivaling the thinnest laptops currently available on the market. This space-efficient form factor not only supports sleek, thin designs but also gives original equipment manufacturers (OEMs) the flexibility to integrate additional functionalities into their products.

"Our ICE technology is revolutionizing the electronics market by providing a new generation of silent, intelligent heat-transferring thermal management solutions. Our latest achievements highlight the impressive scalability of our ICE9 solution," said Carl Schlachte, Chairman, President, and CEO of Ventiva. "Initially showcased in the 'thin and light' laptop category at around 15 W TDP, the ICE9 device now empowers laptop manufacturers to extend these benefits to higher performance systems, setting the stage for the introduction of entire product lines of silent computing products."

Ventiva has released a new white paper titled "Enabling High Performance Silent Computing: A Breakthrough in Laptop Thermal Management," which delves into the crucial balance between managing heat dissipation and achieving quiet laptop operation. As processors become more powerful, they generate increased thermal output, necessitating innovative cooling solutions that do not compromise form factor or acoustics. The white paper explores how enterprises evaluate these options to support their current and future strategies.

Ventiva is collaborating with select partners to commercialize the ICE9 thermal management suite for up to 40 W TDP by 2027. The ICE9 solution for up to 25 W TDP is currently available.